Contact annealing lamp annealing device "RLA-3100-V"
Processing of GaN substrates is also possible! Introduction of contact annealing lamp annealing (RTP) equipment.
The "RLA-3100-V" is a contact annealing lamp annealing (RTP) device that can accommodate a wide range of wafer sizes up to 6 inches. It features a vacuum-designed quartz tube that allows for a clean vacuum (LP) environment and processing in an N2 load lock atmosphere. Additionally, it is equipped with an automatic wafer exchange mechanism, enabling C to C transport. 【Features】 ■ Supports a wide range of wafer sizes up to 6 inches ■ Equipped with an automatic wafer exchange mechanism for C to C transport ■ Improved annealing characteristics due to vacuum compatibility ■ Achieves short TAT with N2 load lock compatibility ■ Capable of processing GaN substrates *For more details, please refer to the PDF document or feel free to contact us.
- Company：ジェイテクトサーモシステム
- Price：Other
